Infineon FF1200R17KP4_B2: High-Performance 1700V IGBT Module for Industrial Drives and Power Conversion

Release date:2025-10-21 Number of clicks:151

Infineon FF1200R17KP4_B2: High-Performance 1700V IGBT Module for Industrial Drives and Power Conversion

The demand for robust, efficient, and reliable power electronics is paramount in industrial applications such as motor drives, renewable energy systems, and industrial power supplies. Addressing this need, the Infineon FF1200R17KP4_B2 stands out as a premier 1700V IGBT module engineered to deliver superior performance in the most demanding environments.

This module is built upon Infineon's advanced IGBT7 technology, which represents a significant leap forward in semiconductor design. The IGBT7 chips feature a micro-pattern trench (MPT) structure that optimizes the trade-off between conduction losses and switching losses. This results in exceptionally low Vce(sat) voltage, reducing power dissipation during operation and enhancing overall system efficiency. Furthermore, the technology enables higher power density, allowing designers to either reduce the size of their systems or achieve higher output without increasing the footprint.

A key attribute of the FF1200R17KP4_B2 is its high current rating of 1200A, combined with the 1700V voltage class. This makes it particularly suited for high-power industrial drives and medium-voltage conversion systems where operational reliability is critical. The module is designed to handle high switching frequencies while maintaining thermal stability, a crucial factor for continuous operation under heavy load.

Thermal management is a cornerstone of this module's design. It features a low thermal resistance and is compatible with various cooling methods, including forced air and liquid cooling. The robust baseplate ensures efficient heat dissipation, which is vital for maintaining performance and extending the operational lifespan of the system. This rugged construction guarantees outstanding reliability even in harsh industrial conditions characterized by temperature fluctuations and mechanical stress.

The module also integrates an advanced PressFIT contact system for the auxiliary emitter. This tool-free press-in technology ensures a gas-tight and highly reliable electrical connection, simplifying the assembly process and significantly enhancing the mechanical robustness of the power stack. It eliminates the need for soldering or screwing, reducing installation time and potential failure points.

ICGOO FIND: The Infineon FF1200R17KP4_B2 is a state-of-the-art power solution that sets a new benchmark for high-voltage, high-current applications. Its integration of cutting-edge IGBT7 technology, impressive power density, and superior thermal performance makes it an indispensable component for engineers aiming to develop next-generation industrial drives and power conversion systems with maximum efficiency and reliability.

Keywords: IGBT7 Technology, 1700V, High Power Density, Low Vce(sat), PressFIT

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